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Defect Detection Type
Measurement per Pad
FOV Size
Height Repeatability
Volume Repeatability
Height Accuracy
Maximum PCB Size
Minimum PCB Size
Maximum PCB Warp
Maximum Paste Height
PCB Thickness Range Insufficient Paste, Excessive Paste, Shape Deformity,
Missing Paste, Bridging, Paste Displacement Volume, Height, XY Position, Area 20 x 20 mm (0.78 x 0.78 in.) ¡À 2 %* ¡À 2 %* No Shadow Effect Mode: 2um High Resolution Mode: 3um 460 x 410 mm (18 x 16 in.) 50 x 50 mm (1.96 x 1.96 in.) ¡À 3.5 mm (¡À 0.14 in.) 400 um (15.7 mils) 0.4 ~ 4 mm (0.0157 ~ 0.1574 in.)
% Gage R & R Data, SPI Daily, Weekly, Monthly Reports
Vision Algorithm
OS
Camera
Probe Type
Dimensions
Weight
Electrical
3D Phase Shift Moir¨¦ Interferometry Windows XP Professional 1M B/W Digital Camera (1024x 1024) No Shadow Effect 870 x 920 x 500 mm (34 x 36 x 19.6 in.) 80Kg (176 lbs) 200 ~ 240 Volts, 15Amps, 50~60 Hz, Single Phase Statistical Ana |