HYSOL KL-G800H电子胶水/塑封胶水/汉高乐泰胶水/塑封方案
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KL-G800H epoxy molding compound is suitable forthin leaded package without any flame retardant..
This materialis designed to achieve JEDEC Level 2 requirements, at 260°C eflow temperature.
KL-G800H meets UL 94 V-0 Flammability at 3.175mmthickness.
TYPICAL PROPERTIES OF UNCURED MATERIALGel Time @ 175 °C, seconds 28Spiral Flow, @ 175°C, cm 115Shelf Life:@ 5oC, months 6TYPICAL PROCESS DATAHandling
Preheat Temperature :Conventional mold, °C 80 to 100Automold, seconds 0 to 5Molding Temperature, °C 150 to 195Molding Pressure, Kg/cm2 40 to 100Transfer Time:Conventional mold, seconds 10 to 15Automold, seconds 4 to 10Curing Time, @ 175oC, seconds:Conventional mold, 70 to 120Automold, 70 to 90Post Cure @ 175°C, hours 4 to 6Huawei KL-G800H has been formulated to provide the best possiblemoldability and as wide a molding latitude as possible.
Althoughmoldingand curing conditions will vary from situation to situation,recommendedstarting ranges are shown above.
KL-G800H环氧树脂成型复合材料适用于不含阻燃剂的引线封装。
该材料设计达到JEDEC二级要求，温度为260°C回流温度。
KL-G800H符合UL 94 V-0易燃性3.175mm厚度。固化材料的典型特性凝胶时间@ 175°C秒秒28螺旋流@ 175°C，115°冰箱寿命：@5oC，月份6工艺流程数据处理预热温度：常规模具，80至100Automold，秒0至5模具温度，℃150至195模压压力，Kg / cm 2 40至100转印时间：常规模具秒10至15Auoldold秒秒4至10℃恒定时间@ 175℃，秒：常规模具，70至120Automold，70至90固化175℃，小时4至6小时KL-G800H已经配制，以提供尽可能*好的可塑性和宽的成型纬度。
虽然模具和固化条件因情况而异，但推荐的开始范围如上所示。 |
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