HYSOL GR750HT-25电子胶水/塑封胶水/汉高乐泰胶水/塑封方案
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Hysol®GR750HT-25™ is an epoxy molding compounddesigned to improve thermal management in semiconductordevices.
GR750HT-25™ meets UL 94 V-0 Flammability at 3.175mmthickness.
TYPICAL PROPERTIES OF UNCURED MATERIALGel Time @ 175 °C, seconds 34Spiral Flow, @ 175°C, cm 55Shelf Life:@ 5oC, months 12Flash & bleed, mm:3.0 mil 1.52.0 mil 11.0 mil 10.5 mil 10.25 mil 0.5TYPICAL PROCESS DATAHandlingPreheat Temperature 85 to 95Molding Temperature, °C 165 to 190Molding Pressure, Kg/cm2 45 to 85Transfer Time, seconds 12 to 20Curing Time, 3 mm section:@ 170oC, seconds 90 to 120@ 190oC, seconds 75 to 105Post Cure @ 175°C, hours 4 to 6GR750HT-25™ has been formulated to provide the bestpossible moldability and as wide a molding latitude as possible.
Although molding and curing conditions will vary from situationto situation, recommended starting ranges are shown aboveStorage
Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.
Powder Storage - Powder or preforms should be stored at 5oCor below, in closed containers.
After removal from coldstorage, the material MUST be allowed to come to roomtemperature, in the sealed container, to avoid moisture contamination.
The suggested waiting time for a standard 15kg carton box is 24 hours.
Hysol®GR750HT-25™是一种环氧树脂模塑料，用于改善半导体器件的热管理.GR750HT-25™符合UL 94 V-0易燃性3.175mm厚度。
固化材料的特性时间175℃，秒34螺旋流，@ 175 °C，cm 55Shelf寿命：@5oC，月12冲洗和流出，mm：3.0密耳1.52.0密耳11.0密耳10.5密耳10.25密耳0.5特殊工艺数据处理预热温度85至95铸型温度，165至190压铸压力，Kg / cm 2 45至85转印时间，秒12至20固化时间，3 mm部分：@170oC，秒90至120 @190oC，秒75至105固化@ 175°C，小时4至6GR750HT-25™已配制成提供*佳可能的成型性和尽可能宽的成型纬度。
尽管成型和固化条件会因情况而异，但推荐的起始范围如上所示
StorageStore产品在未开封的容器中，在干燥的位置。
存储信息可能在产品容器标签上指示。粉末储存 - 粉末或预制 |
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