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胶水公司
联系人:王小姐
女士 (主管) |
电 话:021-51693135 |
手 机:13052326431 |
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ECCOBOND 8177-0电子组装/工业胶水/电子组装胶水/工业用胶 |
ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/ECCOBOND 8177-0电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线:021-51693135 / 021-22818476
ECCOBOND 8177-0 is designed for chip attach applications. Itallows the product to be used with thermally sensitive deviceswithout damaging the assembly.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP):
D = 1.5 Pa.s 65,000
D = 15 Pa.s 13,000
Thixotropic Index 5.0
Specific Gravity 3.9 to 4.0
Work Life @ 25°C, hours 36
Shelf Life @ -40°C, year 1
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
Hot Plate:
6 minutes @ 130°C or
4 minutes @ 150°C
Convection:
10 minutes @ 150°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -40 °C
ECCOBOND 8177-0专为芯片连接应用而设计。它允许产品与热敏设备一起使用而不损坏组件。
固化材料的典型特性
25℃下的粘度,mPa•s(cP):
D = 1.5 Pa.s 65,000
D = 15 Pa.s 13,000
触变指数5.0
比重3.9〜4.0
工作生活@ 25°C,小时36
保质期@ -40°C,第1年
闪点 - 参见MSDS
典型的固化性能
治愈时间表
热板:
在130°C或6分钟
150°C 4分钟
对流:
150°C 10分钟
以上治疗方案是指导性建议。治愈条件(时间和温度)可能会有所不同客户的经验和应用要求以及客户固化 |
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