EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/EMERSON & CUMING E1172A电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
Product Description: E 1172 A is the latest innovative capillary stream Emerson & Cuming's underfill. E 1172 A is a fast-flowing, fast-curing underfill. It is a component that acidifies the epoxy resin to enhance moisture resistance. This combination of innovative properties of the sealant makes it one of today's commercially available capillary underfill. Unlike similar products, E 1172 A is the highest part of the reliability of the high load matched low CTE solder. While E 1172 A in the low cure temperature (135 ° C), working abnormally long life resulted in a very consistent distribution of multiple production shifts
Application: E 1172 A is formulated for very fine pitch area array equipment, 25 is easily filled with filling equipment for micron geometry. It provides a uniform, free sealant layer that maximizes the temperature cycling capability of the array device through its special adhesion with all common stresses by separating the stress away from the solder distribution on the surface
产品描述：E 1172 A是Emerson＆Cuming*新创新的毛细管流化床底盖。 E 1172 A是一种快速流动，快速固化的底部填充物。它是使环氧树脂酸化以增强耐湿性的成分。这种密封剂的创新性能的组合使其成为当今商业可用的毛细管底层填料之一。与同类产品不同，E 1172A是高负载匹配低CTE焊料的可靠性的*高部分。虽然E 1172 A在低固化温度（135°C）下，工作异常长寿命导致多个生产班次的非 |
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