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3119™ cures rapidly at relatively low temperature and provides
excellent adhesion on a wide range of substrates. Typical
applications include the assembly of electronics components
which are heat sensitive.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.1 to 1.3LMS
Yield Point, 25 °C, mPa•s
Cone & Plate Rheometer
10,000 to 38,000LMS
Casson Viscosity @ 25 °C, mPa•s (cP)
Cone & Plate Rheometer
7,000 to 23,000LMS
Pot life @ 25 °C, weeks 3
TYPICAL CURING PERFORMANCE
Recommended Curing Conditions
60 minutes @ 100 °C bondline temperature
120 minutes @ 75 °C bondline temperature
Note: Sufficient time must be added to allow the bond location to
reach the desired cure temperature. Curing profiles should be
developed for each device.
TYPICAL PROPERTIES OF CURED MATERIAL
alpha 2 210×10-6
Water Absorption, ISO 62, %:
24 hours in water @ 23 °C 0.36
Elongation, at break, ISO 527-3, % 3.3
Tensile Strength, at break, ISO 527-3 N/mm2 56
(psi) (8,100)
Tensile Modulus, ISO 527-3 N/mm2 2,300
(psi) (330,000)
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: -15 °C to -25 °C. Storage below minus
(-)25 °C or greater than minus (-)15 °C can adversely affect
product properties.
3119™在相对较低的温度下快速固化并提供
在各种基材上具有优异的附着力。典型
应用包括电子组件的组装
这是热敏感的。
固化材料的典型特性
比重@ 25°C 1.1〜1.3LMS
产量点，25℃，mPa•s
锥板流变仪
10,000到38, |
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