HYSOL KL-6300S电子胶水/塑封胶水/汉高乐泰胶水/塑封方案
技术服务热线:021-51693135 / 021-22818476
Product HYSOL KL-6300S describes epoxy molding compounds with excellent product performance and ease of use.
This material meets the requirements of JEDEC Level 1 at 260 ° C reflow temperature.
Thermal conductivity 0.8 W / mK MSL L1 / 260 ° C Linear flow, cm 58 Hot plate gel time, seconds 23 Filling content% 75 CTEa1, ppM / ° C 15 Tg, ° C 158, main features
Low stress; excellent formability; high reliability; low cost of ownership.
产品HYSOL KL-6300S 描述 环氧塑封料,具有出色产品性能并且易于使 用。
这一材料满足 260℃回流温度下 JEDEC 1 级要求。
导热率 0.8 W/mK MSL L1/260℃ 线性流 动,厘米 58 热板凝胶 时间,秒 23填充含 量 % 75 CTEa1, ppM/℃ 15 Tg, ℃ 158,主要特点
低应力;优良的成形性;高可靠性;低拥有成本。 |