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乐泰 ECCOBOND UV 3000 UV cure adhesive is designed for high throughput assembly operations.
This adhesive can withstand exposure to temperatures as high as 200oC.
TYPICAL PROPERTIES OF UNCURED MATERIAL Viscosity, Brookfield - HBT, 25 °C, mPa•s (cap):Spindle 7, speed 10 rpm 5,300Specific Gravity @ 25oC 1.09Shelf Life @ 25°C (from date of manufacture), days 365Flash Point - See SDSTYPICAL CURING PERFORMANCE
Recommended UV Cure Light Source and Condition: Ultraviolet (UV) light: Light Intensity, mW/cm2 200Spectral Output, nanometers 300 to 500UV Wavelength, nanometers 375Exposure Time vs.
Bond line Thickness:@ 0.005 inch bond line thickness, seconds 20@ 0.01 inch bond line thickness, seconds 35@ 0.125 inch bond line thickness, seconds 45@ 0.25 inch bond line thickness, seconds 60The above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures. STORAGE:Store in original, tightly covered containers in clean, dry areas.
Storage information may be indicated on the product containerlabeling.
Optimal Storage : 25 °C.
乐泰 ECCOBOND UV 3000 UV固化粘合剂专为高通量组装操作而设计。
该粘合剂可以承受高达200℃的温度。
固化的材料的特性粘度，Brookfield - HBT，25°C，map’s（cap）：主轴7，转速10 rpm 5,300特定重力@25 |
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