汉高汉高乐泰乐泰 贴片红胶Chipbond 3616
技术服务热线：021-51693135 / 021-22818476
乐泰 3616
乐泰 3616 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics, and high print speeds are required.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.33
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
250 to 650LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
15 to 55
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat above 100 °C (typically 90-120 seconds @ 150 °C). Rate of cure and final strength will depend on the residence time at the cure temperature.
Cure Speed vs. Time, Temperature
The following graph shows the rate of torque strength developed with time at different temperatures. These times are defined from the moment the adhesive reaches cure temperature. In practice, total oven time may be longer to allow for heat up period. Strength is measured on 1206 capacitors @ 22 °C, tested according to IPC SM817, TM-650 Method 2.4.42.
乐泰3616是专为表面粘接安装设备的印刷电路板波峰焊接之前。特别适合于印刷一系列的网点高度与一个模板厚度和高湿强度特性，和高打印速度是必需的。
固化材料的典型性能
比重@ 25°C 1.33
屈服点，25°C，PA
锥板流变仪：
哈克PK 100，M10 / PK 1 2°锥
250 650lms
卡森粘度@ 25°C，PA的∙
锥板流变仪：
哈克PK 100，M10 / PK 1 2°锥
15到55
闪点-见SDS
典型的固化性能
治疗建议的条件是热暴露100以上°C（通常是90-120秒@ 150°C）。固化速率和*终强度将取决于固化温度的停留时间。
固化速度与时间、温度
不同温度下扭矩强度随时间的变化。这些时间被定义从粘合剂到达固化温度的时刻。在实践中，总烤箱时间可能会更长，以允许升温期间。强度是1206电容器”22°C测量，根据IPC sm817测试方法，tm-650 2.4.42。 |
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