乐泰 3616电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
乐泰 3616 is designed for the bonding of surface mounted
devices to printed circuit boards prior to wave soldering.
Particularly suited to printing a range of dot heights with one
stencil thickness and where high wet strength characteristics,
and high print speeds are required.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.33
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
250 to 650LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
15 to 55
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat
above 100 °C (typically 90-120 seconds @ 150 °C). Rate of
cure and final strength will depend on the residence time at the
cure temperature. Storage
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than
8 °C can adversely affect product properties.
乐泰 3616设计用于表面贴装
设备到波峰焊前的印刷电路板。
特别适合用一个打印一系列点高
模板厚度和湿强度特性高，
并且需要高打印速度。
固化材料的典型特性
比重@ 25°C 1.33
屈服点，25°C，Pa
锥板流变仪：
Haake PK 100，M10 / PK 1 2°锥
250至650LMS
卡松粘度@ 25°C，Pa∙s
锥板流变仪：
Haake PK 100，M10 / PK 1 2°锥
15到55
闪点 - 见SDS
典型的固化性能
固化的推荐条件是暴露于热量
高于100℃（通常在150℃下为90-120秒）。比率
治愈和*终的力量将取决于在的停留时间
治愈温度。
存储
将产品存放在未开封的容器中，干燥处。存储
信息可能在产品容器标签上显示。
*佳储存：2°C至8°C。储存温度低于2°C或更高
8°C会对产品性能产生不利影响。 |
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