HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案 HYSOL MG15F-0140R电子胶水/塑封胶水/汉高乐泰胶水/塑封方案
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Hysol®MG15F-0140R is an anhydride cured molding compound designed for use in high voltage powerapplications requiring good electrical stability at high temperature.
The material is specificallyrecommended for Power Discrete,
High Voltage Rectifier and other applications where up until now,only Silicone molding compounds have been satisfactory.
HandlingMG15F-0140R has been formulated to provide the best possible moldability and as wide a molding latitude aspossible. Although molding and curing conditions will vary from situation to situation, recommended startingranges are shown below.Preheat Temperature, conventional mold, °C 77-94Molding Temperature, °C 177-200Molding Pressure, Kg/cm242-84Transfer Time, seconds 6-15Curing Time, 3 mm section, seconds @ 177°C 60-75 @ 190°C 45-60Post Cure Time/Temperature, hours 8-12 @ 175°C 2-4 @ 190°CPowder
Storage - Powder or preforms should be stored at 5°C, or below, in closed containers.
After removal fromcold storage, the material MUST be allowed to come to room temperature, in the sealed container, to avoidmoisture contamination.
The suggested waiting time is 24 hours.
Hysol®MG15F-0140R是一种酸酐固化的模塑 |
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