ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/ECCOBOND S-3869电子组装/工业胶水/电子组装胶水/工业用胶
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ECCOBOND S-3869 is a thermosetting, dielectric adhesivedeveloped for GaN chip bonding for high-brightness LEDs. Itfeatures strong heat / UV resistance and can be applied by pintransfer, stamping and dispensing.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate, @ 25 °C mPa∙s (cP):
Speed 10 rpm 4,200
Specific Gravity @ 25oC 1.28
Pot Life @ 25oC, hours 8
Shelf Life @ -40°C, months 3
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
2 hours @ 160°C
Shrinkage on Cure
Cure Shrinkage, % 2.1
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -40 °C
ECCOBOND S-3869是一种热固性介电胶粘剂开发用于高亮度LED的GaN芯片接合。它具有强热/抗紫外线性能，可通过针脚施加转移，冲压和分配。
固化材料的典型特性
粘度，锥和板，@ 25°C mPa∙s（cP）：
速度10转4,200
比重@25oC1.28
五十八点零五分钟
保质期@ -40°C，月3
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