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乐泰 3128 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on aide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies.
Particularly suited where low curing temperatures are required for heat sensitivecomponents.
TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.6Yield Point, 25 °C, mPa•sCone & Plate Rheometer44,000Casson Viscosity @ 25 °C, mPa•s (cP)Cone & Plate Rheometer7,000 to 27,000LMSPot life @ 25 °C, weeks 3Shelf Life @ -25 to -15 °C, days 365TYPICAL CURING PERFORMANCE Recommended Curing Conditions20 minutes @ 80 °C bond line temperature60 minutes @ 60 °C bond line temperature Note: Sufficient time must be added to allow the bond location to reach the desired cure temperature. Curing profiles should be developed for each device.
TYPICAL PROPERTIES OF CURED MATERIAL Cured for 60 minutes @ 80 °Physical Properties Density @ 25 °C, g/cm3 1.7Volume Shrinkage, ASTM D 792, % 3.1Linear Shrinkage, ASTM D 792, % 1.0Shore Hardness, ISO 868, Udometer D 88Glass Transition Temperature, °C:(Tg) via TMA , ISO 11359-2 45Coefficient of Thermal Expansion,
乐泰 3128是热固化环氧树脂的一部分。
该产品设计为在低温下固化，并在相当短的时间内在各种材料上提供优异的附着力。典型应用包括存储卡，CCD / CMOS组件。特别适用于热敏组分需要低固化温度。
固化材料的特性：25°C 1.6°场，25°C，mPa•sCone＆板流变仪44,000Casson粘度@ 25°C，mPa•s（cP）锥＆板流变仪7000〜27000LMSPot寿命@ 25°C，周3Shelf寿命@ -25至-15°C，天365特殊固化性能推荐固化条件20分钟@ 80°C粘 |
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