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LF700™ solder paste is a halide-free, no clean, Pb-free solder
paste, which has a broad process window for printing, reflow
and humidity resistance. LF700™ has been formulated to give
low voiding in BGA joints, a high tack force to resist component
movement during high speed placement, long printer abandon
times and excellent solderability over a wide range of reflow
profiles in air and nitrogen and across a wide range of surface
finishes including Ni/Au, Immersion Sn, Immersion Ag and
OSP Copper. Solder Powder:
Careful control of the atomisation process for production of
solder powders for LF700™ solder pastes ensures that the
solder powder is produced to a quality level that exceeds
IPC/J-STD-006 & EN29453 requirements for sphericity, size
distribution, impurities and oxide levels. Minimum order
requirements may apply to certain alloys and powder sizes, for
availability contact your local technical service helpdesk. Storage:
It is recommended to store LF700™ at 0 to 10°C. (NB
cartridges should be stored tip down to prevent the formation of
air pockets). The paste should be removed from cold storage a
minimum of 8 hours before use. Do not use forced heating
methods to bring solder paste up to temperature. Multicore™
LF700™ has been formulated to minimize flux seperation on
storage but should this occur, gentle stiring for 15 seconds will
return the product to it's correct rheological performance. To
prevent contamination of unused product, do not return any
material to its original container. For futher specific shelf l |
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