ECCOBOND 2332电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
ECCOBOND 2332 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100°C. This product combines toughness at low temperatures plus high peel and tensile shear strengths over a very broad temperature range.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP) 65,000 to
85,000
Specific Gravity 1.17 to
1.23
Shelf Life @ 0 to 8°C, months 6
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage: 0 to 8°C. Storage greater than or below 0 to 8°C can adversely affect product properties.
ECCOBOND 2332是一种无溶剂环氧树脂粘合剂，在低至100℃的温度下固化时，会发生高粘结强度。该产品在非常宽的温度范围内结合了低温韧性和高剥离强度和拉伸剪切强度。
固化材料的典型特性
粘度@ 25°C，mPa∙s（cP）65,000至
85,000
比重1.17到
1.23
保质期0至8°C，月6
以上治疗方案是指导性建议。固化条件（时间和温度）可能会根据客户的经验和应用要求以及客户固化设备，烤箱装载量和实际烤箱温度而有所不同。
存储
将产品存放在未开封的容器中，干燥处。存储信息可能在产品容器标签上显示。
*佳储存：0至8°C。超过或低于0至8°C的储存可能会对产品性能产生不利影响。 |
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