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技术服务热线：021-51693135 / 021-22818476
乐泰 ABLESTIK QMI536HT die attach paste was designed to
attach integrated circuits and components to advanced substrates.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP):
Speed 5 rpm 13,000
Thixotropic Index (0.5/5 rpm) 5.5
Specific Gravity @ 25oC 1.25
Pot life @ 25 °C, hours 24
Shelf Life @ -40°C, days 365
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Conventional Oven
15 minutes @ 150°C at bondline
Snap Cure Schedule
≥10 seconds @ 150°C at bondline
Tunnel Oven configured with hot gas or IR
≥10 seconds @ 150°C at bondline
SkipCure Process
≥8 seconds @ 150°C at bondline
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on customers'
experience and their application requirements, as well as customer
curing equipment, oven loading and actual oven temperatures
Storage
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling.
Optimal Storage : -40 °C 乐泰 ABLESTIK QMI536HT贴片膏被设计成
将集成电路和组件连接到高级基板。
固化材料的典型特性
25℃下的粘度，mPa•s（cP）：
速度5 rpm 13,000
触变指数（0.5 / 5 rpm）5.5
比重@25oC1.25
适用于25°C，24小时
保质期@ -40°C，365天
闪点 - 见SDS
典型的固化性能
常规烤箱
15分钟@ 150°C
治疗时间表
在粘合线上150℃下≥10秒
隧道炉配置热气或红外线
在粘合线上150℃下≥10秒
SkipCure过程
在粘合线上150℃下≥8秒
以上治疗方案是准则建议。 |
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