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乐泰 3129 is a one part, heat curable epoxy. This product
is designed to cure at low temperature and gives excellent
adhesion on a wide range of materials in considerably short
time. Typical applications include Memory cards, CCD/CMOS
Assemblies. Particularly suited where low curing temperatures
are required for heat sensitive components.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.52
Viscosity @ 25°C, mPa•s (cP):
Haake PK100, Cone PK1, 2°:
Shear rate @ 2 s
-1 46,000
Shear rate @ 20 s
-1 12,000
Casson Viscosity @ 25 °C, mPa•s (cP):
Haake PK100, Cone PK1, 2° 4,200
Yield Point, 25 °C, mPa•s 39,000
Pot life @ 25 °C, days >21
TYPICAL CURING PERFORMANCE
Recommended Curing Conditions
5 to 10 minutes @ 80 °C
Note: With all fast cure systems, the time required for cure depends
on the rate of heating. Conditions where a hot plate or heat sink is
used are optimum for fastest cure. Cure rates depend on the mass of
material to be heated and intimate contact with the heat source. Use
suggested cure conditions as general guidelines. Other cure
conditions may yield satisfactory results.
Storage
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling.
Optimal Storage: -15 °C to -25 °C. Storage below minus (-)25 °C
or greater than minus (-)15 °C can adversely affect product
properties.
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