乐泰 3563电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
乐泰®3563™ is a rapid curing, fast flowing, liquid epoxy
designed for use as a capillary flow underfill for packaged ICs,
such as CSPs and BGAs. Its rheology is designed to allow it to
penetrate gaps as small as 25 μm. When fully cured, it
minimizes induced stress at solder joint and thus improves
thermal cycling performance.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.52
Viscosity, Cone & Plate rheometer, 2 ° Cone, mPa•s (cP):
Temperature: 25 °C, Shear Rate: 5 s
-1 5,000 to 12,000LMS
Temperature: 25 °C, Shear Rate: 20 s
-1 5,000 to 12,000
Capillary Flow Rate, seconds:
Flow time, 100 °C, glass to glass, 25 μm:
6.35 mm flow ≤15
12.7 mm flow ≤45LMS
25.4 mm flow ≤150
VOC, ASTM D 3960, g/l <10
Moisture Content, ASTM D 4017, % 0.01
Total Volatile Content, ASTM D 2369, % <1
Filler Content, % 40
Particle Size, μm:
Average 1 to 2
Maximum <10
Pot life @ 22 °C, hours 8 to 12
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Product shall be ideally stored at ≤-40 °C.
乐泰®
3563™是快速固化，快速流动的液体环氧树脂
设计用于封装IC的毛细管流动底部填充，
如CSP和BGA。其流变学设计允许它
穿透小至25μm的间隙。当完全治愈，它
*大限度地减少焊点处的应力，从而提高焊接接头的应力
热循环性能。
固化材料的典型特性
比重@ 25°C 1.52
粘度，锥板流变仪，2°锥，mPa•s（cP）：
温度：25°C，剪切速率：5 s
-1 5,000至12,000LMS
温度：25°C，剪切速率：20 s
-1 5,000至12,000
毛细管流量，秒数：
流动时间，100°C，玻璃到玻璃，25μm：
6.35毫米流量≤15
12.7毫米流量≤45LMS
25.4毫米流量≤150
VOC，ASTM D 3960，g / l <10
水分含量，ASTM D 4017，％0.01
总挥发物含量，ASTM D 2369，％<1
填料含量％40
粒径μm：
平均1到2
*大<10
适用于22°C，8至12小时
存储
将产品存放在未开封的 |
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