ABLEBOND 8700K电子组装/工业胶水/电子组装胶水/工业用胶
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ABLEBOND®8700K adhesive provides excellent adhesion tothin film and thick film gold surfaces. This adhesive retains itsdispensed height after cure, without slumping.
MIL-STD-883
ABLEBOND®
8700K meets the requirements of MIL-STD-883,
Method 5011.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP) 45,000
Work Life @ 25°C, days 30
Shelf Life @ -40°C (from date of manufacture), year 1
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 175°C
Alternative Cure Schedule 1
2 hours @ 160°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures.
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C orgreater than minus (-)40 °C can adversely affect product
properties.
ABLEBOND®8700K粘合剂提供了优异的粘附力,适用于薄膜和厚膜金表面。该粘合剂在固化后保持其分配高度,而不会下沉。
MIL-STD-883
ABLEBOND®
8700K符合MIL-STD-883的要求,
方法5011。
固化材料的典型特性
25℃时的粘度,mPa•s(cP)45,000
25°C,30天工作
保质期@ -40°C(从制造日期),第1年
闪点 - 参见MSDS
典型的固化性能
治愈时间表
175℃1小时
替代治疗附表1
2小时@ 160°C
以上治疗方案是指导性建议。保养条件(时间和温度)可能会根据客户的经验和应用要求,以及定制设备,烤箱装载和实际烤箱温度而有所不同。
存储
将产品存放在未开封的容器中,干燥处。存储信息可能在产品容器标签上显示。*佳存储温度:-40°C。存储在负( - )40°C以下,比负( - )40°C会对产品产生不利影响属性。 |