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TECHNOMELT PA 646 high performance thermoplastic polyamide
is designed to meet low pressure molding process requirements. This
product can be processed at low processing pressure due to its low
viscosity, allowing encapsulation of fragile components without
damage. This material produces no toxic fumes in process and
provides a good balance of low and high temperature performance.
TECHNOMELT PA 646 is particularly suited to applications such as
computer connectors and memory sticks where high strength and
hardness are desired.
LIQUID-STATE TYPICAL PROPERTIES
Viscosity @ 225 °C, mPa∙s (cP) 4,500
Specific Gravity @ 25 °C 0.98
Softening Point, °C 170 to 180
TYPICAL PROCESS DATA
Handling:
Molding Temperature, °C 200 to 240
TECHNOMELT PA 646 has been formulated to provide the best
possible moldability and as wide a molding latitude as possible. Much
of the final molding parameters will be determined by the mold design.
Although molding and curing conditions will vary from situation to
situation, recommended starting ranges are shown above.
Storage
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling. TECHNOMELT PA 646高性能热塑性聚酰胺
旨在满足低压成型工艺要求。这个
产品可以在低加工压力下进行处理，因为其低
粘度，允许无脆性组分的包封
损伤。这种材料在生产过程中不产生有毒的烟雾
提供良好的低温和高温性能平衡。
TECHNOMELT PA 646特别适用于诸如
电脑连接器和记忆棒，其强度高
需要硬度。
液态典型特性
粘度@ 225℃，mPa•s（cP）4,500
比重@ 25°C 0.98
软化点，℃170至180
典型工艺数据
处理：
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