ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/ECCOBOND 285电子组装/工业胶水/电子组装胶水/工业用胶
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Product Description: ECCOBOND 285 is a very versatile, versatile curing agent that can be cured in a different way as shown below. All curing agents impart a degree of thixotropic material to the uncured agent even at elevated temperatures. This property is in fact protected from drooping or running on a vertical or top surface or run out when used to lose fit, such as pipe fittings
Application: ECCOBOND 285 produces rigid, highly resistant to most materials (including metal, glass, ceramic and most plastics.) As a 100% solid binder, it exhibits the same non-porous surface on porous or the like ECCOBOND 285 There are two outstanding applications that should be of particular interest in property applications. Thermal expansion coefficient ECCOBOND 285 is generally much lower than brass, copper, and aluminum commonly used in adhesives. The heat conductivity is high. This combination works well Overcoming the failure due to thermal cycling.
Instructions for use: curing agent selection: from the information provided, select the most suitable for your catalyst requirements: catalyst 9. Room temperature curing - for 45 minutes 0,5 kg mass - thixotropy and viscosity highest - paste consistency - can be applied to the vertical or top surface in the thick part without flow or sagging - continuous use up to 120 ° C for a short time exposed to 150 ° C Catalyst 11.
产品说明：ECCOBOND 285是一种非常通用，通用的固化剂，可以通过以下不同的方式固化。所有固化剂即使在升高的温度下也向未固化剂赋予一定程度的触变材料。实际上，该属性在垂直或顶部表面上不会下垂或运行，或者当用于失去配合时会流出，例如管件
应用：ECCOBOND 285对大多数材料（包括金属，玻璃，陶瓷和大多数塑料）产生刚性，高度 |
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