汉高汉高乐泰乐泰 3119
技术服务热线：021-51693135 / 021-22818476
乐泰 ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.1 to 1.3LMS
Yield Point, 25 °C, mPa•s
Cone & Plate Rheometer
10,000 to 38,000LMS
Casson Viscosity @ 25 °C, mPa•s (cP)
Cone & Plate Rheometer
7,000 to 23,000LMS
Pot life @ 25 °C, weeks 3
TYPICAL CURING PERFORMANCE
Recommended Curing Conditions
60 minutes @ 100 °C bondline temperature
120 minutes @ 75 °C bondline temperature
Note: Sufficient time must be added to allow the bond location to reach the desired cure temperature. Curing profiles should be developed for each device.
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured for 60 minutes @ 100 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm2 24
(psi) (3,500)
Epoxyglass (thickness 1.6 mm) N/mm2 ≥10LMS
(psi) (≥1,450)
TYPICAL ENVIRONMENTAL RESISTANCE
Cured for 60 minutes @ 100 °C
Lap Shear Strength, ISO 4587:
Epoxy glass (thickness 1.6 mm
乐泰 ABLESTIK治愈3119迅速在相对低的温度下，提供一系列优越的附着力。典型应用包括组装的电子元件是热敏。
固化材料的典型性能
比重@ 25°C 1.1 1.3lms
屈服点，25°C，MPa•s
锥板流变仪
10000 38000lms
卡森粘度@ 25°C，MPA•S（CP）
锥板流变仪
7000 23000lms
锅寿命@ 25°C，周3
典型的固化性能
推荐固化条件
60分钟@ 100°胶层温度C
120分钟@ 75°胶层温度C
注：必须添加足够的时间，以允许键的位置，以达到所需的固化温度。固化配置应开发为每个设备。
固化材料的典型性能
治愈60分钟@ 100°C
物理性质：
密度@ 25°C，克/厘米1.23
邵氏硬度、ISO 868，Durometer D 87
玻璃化转变温度：
（TG）DMA，ASTM E 1640 110
热膨胀系数，
ISO 11359-2，K-1：
α1 65×10-6
α2 210×10-6
吸水率，ISO 62，%：
24小时水中@ 23°C 0.36
伸 |
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