乐泰 3619电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
3619™ is designed for the bonding of surface mounted devices
to printed circuit boards prior to wave soldering. Particularly
suited where low curing temperatures are required with heat
sensitive components, and in applications where short curing
times are required.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.22
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
200 to 450LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
1 to 4
Particle Size, μm <100
Flash Point - See MSDS
VISCOSITY VS. TEMPERATURE
The following graph shows a typical temperature-viscosity
curve as measured using a Haake rotoviscometer PK100,
M10/PK1 2° Cone system at a shear rate of 2 s
-1 which is
representative of the shear rate in the dispense nozzle.
Increased cabin or nozzle temperature in the 30°C to 35°C
range may aid dispense performance at higher dispense
speeds.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or
greater than 8 °C can adversely affect product properties.
3619™是为表面贴装设备而设计的
到波峰焊前的印刷电路板。尤其
适用于需要低固化温度的热量
敏感组件，以及短时间固化的应用
需要时间。
固化材料的典型特性
比重@ 25°C 1.22
屈服点，25°C，Pa
锥板流变仪：
Haake PK 100，M10 / PK 1 2°锥
200到450LMS
卡松粘度@ 25°C，Pa∙s
锥板流变仪：
Haake PK 100，M10 / PK 1 2°锥
1到4
粒径μm<100
闪点 - 参见MSDS
粘度VS.温度
下图显示了典型的温度 - 粘度
使用Haake旋转透视计PK100测量的曲线，
M10 / PK1 2°锥形系统，剪切速度为2 s
-1是
代表分配喷嘴中的剪切速率。
机舱或喷嘴温度在30°C至35°C时提高
范围可能有助于在更高的分配时分配性能
速度。
存储
将产品存放在未开封的容器中 |
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